PCB and FPC MANUFACTURING CAPABILITIES
1.
PCB TYPE
Single Sided Board 
Silver Through Hole
Flex Board Rigid-Flex Board Double sided board
Layers 1L - 2L 1~6L 2~12L 2L
Material Types
CEM-1, FR-1, FR-2, 
CEM-3, FR-4, ALUMINUM PCB
PI, PET
PI, PET,FR-4, 
High TG FR-4, 
Halogen free FR-4,
High Thermal conductive material
High Frequency Material
FR-4,
High TG FR-4, 
Halogen free FR-4, 
High Thermal, 
High Frequency Embedded Capacitor & Resistor
Min. Hole size
0.7mm by punching 
0.3mm by CNC
0.15mm-0.2 mm 0.15mm-0.2 mm 0.15mm-0.2 mm
Min Track & Gap D/F 0.1/0.1mm 0.075/0.075mm 0.075/0.075mm 0.075/0.075mm
PCB Thickness 0.4 - 2.0mm ≥0.05mm 0.25~3.0mm 0.4 - 6.0mm
PCB Thickness HASL: 1-40um N/A HASL: 1-40um HASL: 1-40um
ENIG: Ni Min;2.54um;
Au 0.03~0.05um)
Gold – plate Gold – plate
ENIG Ni Min;2.54um 
Au :0.0254~0.0762um
OSP 0.15~0.3um ENIG / OSP ENIG / OSP  Gold - plate+ OSP


2.
PCB TYPE
Multilayers
Production
HDI Boards
Production
HDI Boards
Capability
Layers 4~18L 1+N+1(N=2~8) 3+N+3(N=2~8)
Material Types
FR-4,
High TG FR4, 
Halogen free, 
High Thermal, 
High Frequency Embedded 
Capacitor & Resistor
FR-4, 
High TG FR4, 
Halogen free, 
High Thermal, 
High Frequency Embedded 
Capacitor & Resistor
FR-4, 
High TG FR-4, 
Halogen free, 
High Thermal, 
High Frequency, Embedded 
Capacitor & Resistor
Min. Hole size 0.15mm-0.2 mm laser blind 0.1mm laser blind 0.1mm
Min Track & Gap 0.075/0.075mm 0.075/0.075mm 0.075/0.075mm
PCB Thickness 0.4 - 6.0mm 0.4 - 6.0mm 0.4 - 6.0mm
PCB Thickness HASL: 1-40um HASL: 1-40um HASL: 1-40um
ENIG: Ni Min;2.54um;
Au 0.03~0.05um)
ENIG Ni Min;2.54um 
Au :0.0254~0.0762um
ENIG Ni Min;2.54um 
Au :0.0254~0.0762um
Gold - plate+ OSP Gold - plate+ OSP Gold - plate+ OSP